--- _id: '796' abstract: - lang: eng text: We present the fabrication and characterization of an aluminum transmon qubit on a silicon-on-insulator substrate. Key to the qubit fabrication is the use of an anhydrous hydrofluoric vapor process which selectively removes the lossy silicon oxide buried underneath the silicon device layer. For a 5.6 GHz qubit measured dispersively by a 7.1 GHz resonator, we find T1 = 3.5 μs and T∗2 = 2.2 μs. This process in principle permits the co-fabrication of silicon photonic and mechanical elements, providing a route towards chip-scale integration of electro-opto-mechanical transducers for quantum networking of superconducting microwave quantum circuits. The additional processing steps are compatible with established fabrication techniques for aluminum transmon qubits on silicon. acknowledgement: This work was supported by the AFOSR MURI Quantum Photonic Matter (Grant No. 16RT0696), the AFOSR MURI Wiring Quantum Networks with Mechanical Transducers (Grant No. FA9550-15-1-0015), the Institute for Quantum Information and Matter, an NSF Physics Frontiers Center (Grant No. PHY-1125565) with the support of the Gordon and Betty Moore Foundation, and the Kavli Nanoscience Institute at Caltech. A.J.K. acknowledges the IQIM Postdoctoral Fellowship. article_number: '042603' article_processing_charge: No author: - first_name: Andrew J full_name: Keller, Andrew J last_name: Keller - first_name: Paul full_name: Dieterle, Paul last_name: Dieterle - first_name: Michael full_name: Fang, Michael last_name: Fang - first_name: Brett full_name: Berger, Brett last_name: Berger - first_name: Johannes M full_name: Fink, Johannes M id: 4B591CBA-F248-11E8-B48F-1D18A9856A87 last_name: Fink orcid: 0000-0001-8112-028X - first_name: Oskar full_name: Painter, Oskar last_name: Painter citation: ama: Keller AJ, Dieterle P, Fang M, Berger B, Fink JM, Painter O. Al transmon qubits on silicon on insulator for quantum device integration. Applied Physics Letters. 2017;111(4). doi:10.1063/1.4994661 apa: Keller, A. J., Dieterle, P., Fang, M., Berger, B., Fink, J. M., & Painter, O. (2017). Al transmon qubits on silicon on insulator for quantum device integration. Applied Physics Letters. American Institute of Physics. https://doi.org/10.1063/1.4994661 chicago: Keller, Andrew J, Paul Dieterle, Michael Fang, Brett Berger, Johannes M Fink, and Oskar Painter. “Al Transmon Qubits on Silicon on Insulator for Quantum Device Integration.” Applied Physics Letters. American Institute of Physics, 2017. https://doi.org/10.1063/1.4994661. ieee: A. J. Keller, P. Dieterle, M. Fang, B. Berger, J. M. Fink, and O. Painter, “Al transmon qubits on silicon on insulator for quantum device integration,” Applied Physics Letters, vol. 111, no. 4. American Institute of Physics, 2017. ista: Keller AJ, Dieterle P, Fang M, Berger B, Fink JM, Painter O. 2017. Al transmon qubits on silicon on insulator for quantum device integration. Applied Physics Letters. 111(4), 042603. mla: Keller, Andrew J., et al. “Al Transmon Qubits on Silicon on Insulator for Quantum Device Integration.” Applied Physics Letters, vol. 111, no. 4, 042603, American Institute of Physics, 2017, doi:10.1063/1.4994661. short: A.J. Keller, P. Dieterle, M. Fang, B. Berger, J.M. Fink, O. Painter, Applied Physics Letters 111 (2017). date_created: 2018-12-11T11:48:33Z date_published: 2017-07-01T00:00:00Z date_updated: 2023-09-27T12:13:36Z day: '01' department: - _id: JoFi doi: 10.1063/1.4994661 external_id: isi: - '000406779700031' intvolume: ' 111' isi: 1 issue: '4' language: - iso: eng main_file_link: - open_access: '1' url: https://arxiv.org/abs/1703.10195 month: '07' oa: 1 oa_version: Submitted Version publication: Applied Physics Letters publication_identifier: issn: - '00036951' publication_status: published publisher: American Institute of Physics publist_id: '6857' quality_controlled: '1' scopus_import: '1' status: public title: Al transmon qubits on silicon on insulator for quantum device integration type: journal_article user_id: c635000d-4b10-11ee-a964-aac5a93f6ac1 volume: 111 year: '2017' ...