---
_id: '796'
abstract:
- lang: eng
text: We present the fabrication and characterization of an aluminum transmon qubit
on a silicon-on-insulator substrate. Key to the qubit fabrication is the use of
an anhydrous hydrofluoric vapor process which selectively removes the lossy silicon
oxide buried underneath the silicon device layer. For a 5.6 GHz qubit measured
dispersively by a 7.1 GHz resonator, we find T1 = 3.5 μs and T∗2 = 2.2 μs. This
process in principle permits the co-fabrication of silicon photonic and mechanical
elements, providing a route towards chip-scale integration of electro-opto-mechanical
transducers for quantum networking of superconducting microwave quantum circuits.
The additional processing steps are compatible with established fabrication techniques
for aluminum transmon qubits on silicon.
acknowledgement: This work was supported by the AFOSR MURI Quantum Photonic Matter
(Grant No. 16RT0696), the AFOSR MURI Wiring Quantum Networks with Mechanical Transducers
(Grant No. FA9550-15-1-0015), the Institute for Quantum Information and Matter,
an NSF Physics Frontiers Center (Grant No. PHY-1125565) with the support of the
Gordon and Betty Moore Foundation, and the Kavli Nanoscience Institute at Caltech.
A.J.K. acknowledges the IQIM Postdoctoral Fellowship.
article_number: '042603'
article_processing_charge: No
author:
- first_name: Andrew J
full_name: Keller, Andrew J
last_name: Keller
- first_name: Paul
full_name: Dieterle, Paul
last_name: Dieterle
- first_name: Michael
full_name: Fang, Michael
last_name: Fang
- first_name: Brett
full_name: Berger, Brett
last_name: Berger
- first_name: Johannes M
full_name: Fink, Johannes M
id: 4B591CBA-F248-11E8-B48F-1D18A9856A87
last_name: Fink
orcid: 0000-0001-8112-028X
- first_name: Oskar
full_name: Painter, Oskar
last_name: Painter
citation:
ama: Keller AJ, Dieterle P, Fang M, Berger B, Fink JM, Painter O. Al transmon qubits
on silicon on insulator for quantum device integration. Applied Physics Letters.
2017;111(4). doi:10.1063/1.4994661
apa: Keller, A. J., Dieterle, P., Fang, M., Berger, B., Fink, J. M., & Painter,
O. (2017). Al transmon qubits on silicon on insulator for quantum device integration.
Applied Physics Letters. American Institute of Physics. https://doi.org/10.1063/1.4994661
chicago: Keller, Andrew J, Paul Dieterle, Michael Fang, Brett Berger, Johannes M
Fink, and Oskar Painter. “Al Transmon Qubits on Silicon on Insulator for Quantum
Device Integration.” Applied Physics Letters. American Institute of Physics,
2017. https://doi.org/10.1063/1.4994661.
ieee: A. J. Keller, P. Dieterle, M. Fang, B. Berger, J. M. Fink, and O. Painter,
“Al transmon qubits on silicon on insulator for quantum device integration,” Applied
Physics Letters, vol. 111, no. 4. American Institute of Physics, 2017.
ista: Keller AJ, Dieterle P, Fang M, Berger B, Fink JM, Painter O. 2017. Al transmon
qubits on silicon on insulator for quantum device integration. Applied Physics
Letters. 111(4), 042603.
mla: Keller, Andrew J., et al. “Al Transmon Qubits on Silicon on Insulator for Quantum
Device Integration.” Applied Physics Letters, vol. 111, no. 4, 042603,
American Institute of Physics, 2017, doi:10.1063/1.4994661.
short: A.J. Keller, P. Dieterle, M. Fang, B. Berger, J.M. Fink, O. Painter, Applied
Physics Letters 111 (2017).
date_created: 2018-12-11T11:48:33Z
date_published: 2017-07-01T00:00:00Z
date_updated: 2023-09-27T12:13:36Z
day: '01'
department:
- _id: JoFi
doi: 10.1063/1.4994661
external_id:
isi:
- '000406779700031'
intvolume: ' 111'
isi: 1
issue: '4'
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://arxiv.org/abs/1703.10195
month: '07'
oa: 1
oa_version: Submitted Version
publication: Applied Physics Letters
publication_identifier:
issn:
- '00036951'
publication_status: published
publisher: American Institute of Physics
publist_id: '6857'
quality_controlled: '1'
scopus_import: '1'
status: public
title: Al transmon qubits on silicon on insulator for quantum device integration
type: journal_article
user_id: c635000d-4b10-11ee-a964-aac5a93f6ac1
volume: 111
year: '2017'
...