Electron doping in bottom up engineered thermoelectric nanomaterials through HCl mediated ligand displacement
M. Ibáñez, R. Korkosz, Z. Luo, P. Riba, D. Cadavid, S. Ortega, A. Cabot, M. Kanatzidis, Journal of the American Chemical Society 137 (2015) 4046–4049.