{"department":[{"_id":"JoFi"}],"publisher":"American Physical Society","day":"22","year":"2016","user_id":"3E5EF7F0-F248-11E8-B48F-1D18A9856A87","month":"07","date_published":"2016-07-22T00:00:00Z","citation":{"chicago":"Dieterle, Paul, Mahmoud Kalaee, Johannes M Fink, and Oskar Painter. “Superconducting Cavity Electromechanics on a Silicon-on-Insulator Platform.” <i>Physical Review Applied</i>. American Physical Society, 2016. <a href=\"https://doi.org/10.1103/PhysRevApplied.6.014013\">https://doi.org/10.1103/PhysRevApplied.6.014013</a>.","apa":"Dieterle, P., Kalaee, M., Fink, J. M., &#38; Painter, O. (2016). Superconducting cavity electromechanics on a silicon-on-insulator platform. <i>Physical Review Applied</i>. American Physical Society. <a href=\"https://doi.org/10.1103/PhysRevApplied.6.014013\">https://doi.org/10.1103/PhysRevApplied.6.014013</a>","ista":"Dieterle P, Kalaee M, Fink JM, Painter O. 2016. Superconducting cavity electromechanics on a silicon-on-insulator platform. Physical Review Applied. 6(1), 014013.","mla":"Dieterle, Paul, et al. “Superconducting Cavity Electromechanics on a Silicon-on-Insulator Platform.” <i>Physical Review Applied</i>, vol. 6, no. 1, 014013, American Physical Society, 2016, doi:<a href=\"https://doi.org/10.1103/PhysRevApplied.6.014013\">10.1103/PhysRevApplied.6.014013</a>.","short":"P. Dieterle, M. Kalaee, J.M. Fink, O. Painter, Physical Review Applied 6 (2016).","ieee":"P. Dieterle, M. Kalaee, J. M. Fink, and O. Painter, “Superconducting cavity electromechanics on a silicon-on-insulator platform,” <i>Physical Review Applied</i>, vol. 6, no. 1. American Physical Society, 2016.","ama":"Dieterle P, Kalaee M, Fink JM, Painter O. Superconducting cavity electromechanics on a silicon-on-insulator platform. <i>Physical Review Applied</i>. 2016;6(1). doi:<a href=\"https://doi.org/10.1103/PhysRevApplied.6.014013\">10.1103/PhysRevApplied.6.014013</a>"},"intvolume":"         6","main_file_link":[{"open_access":"1","url":"http://arxiv.org/abs/1601.04019"}],"title":"Superconducting cavity electromechanics on a silicon-on-insulator platform","quality_controlled":"1","publication":"Physical Review Applied","language":[{"iso":"eng"}],"article_number":"014013","publication_status":"published","issue":"1","doi":"10.1103/PhysRevApplied.6.014013","type":"journal_article","_id":"1354","scopus_import":1,"oa":1,"volume":6,"abstract":[{"lang":"eng","text":"Fabrication processes involving anhydrous hydrofluoric vapor etching are developed to create high-Q aluminum superconducting microwave resonators on free-standing silicon membranes formed from a silicon-on-insulator wafer. Using this fabrication process, a high-impedance 8.9-GHz coil resonator is coupled capacitively with a large participation ratio to a 9.7-MHz micromechanical resonator. Two-tone microwave spectroscopy and radiation pressure backaction are used to characterize the coupled system in a dilution refrigerator down to temperatures of Tf=11  mK, yielding a measured electromechanical vacuum coupling rate of g0/2π=24.6  Hz and a mechanical resonator Q factor of Qm=1.7×107. Microwave backaction cooling of the mechanical resonator is also studied, with a minimum phonon occupancy of nm≈16 phonons being realized at an elevated fridge temperature of Tf=211  mK."}],"publist_id":"5892","date_updated":"2021-01-12T06:50:06Z","oa_version":"Preprint","author":[{"first_name":"Paul","last_name":"Dieterle","full_name":"Dieterle, Paul"},{"full_name":"Kalaee, Mahmoud","first_name":"Mahmoud","last_name":"Kalaee"},{"id":"4B591CBA-F248-11E8-B48F-1D18A9856A87","full_name":"Fink, Johannes M","last_name":"Fink","orcid":"0000-0001-8112-028X","first_name":"Johannes M"},{"full_name":"Painter, Oskar","last_name":"Painter","first_name":"Oskar"}],"status":"public","date_created":"2018-12-11T11:51:32Z"}